Besi develops and manufactures semiconductor back-end processing equipment for advanced precision machinery, and has the world’s top technology share in this field.
Headquartered in Duiven, the Netherlands, it is a global company with seven facilities in Asia and Europe for production and development activities and eight sales and service offices in Europe, Asia and North America.
Besi continues to develop and market leading-edge systems that pursue high levels of accuracy, reliability and productivity at low cost. As a lineup, we propose systems that support almost all back-end assembling processes including lead frame, substrate, and wafer level packaging.
Toshin Bldg. 4-17 Kaigandori, Naka-ku, Yokohama, 231-0002 Japan
+81-45-222-6420 : Phone / +81-45-222-6407 : Fax