As Die Attach process system, Besi offers 4 categories,
Multi Module Bonder
Epoxy Die Bonder
Soft Solder Die Bonder
Flip Chip Bonder
which keep evolving by equipped high end technologies to meet ever-growing semiconductor applications.
Multi Module Attach
Datacon 2200Evo Series
Compatible with various applications by flexible equipment configuration
Model :
Datacon 2200Evo plus
Datacon 2200Evo hs
Datacon2200Evo advanced
The Datacon2200Evo series is a flexible multi-module assembly system that can provide optimal proposals for various customer requirements such as high precision, compactness, flip chip, special applications, etc.
Applications:
Camera module bonding, LED module bonding, HDD module bonding, Special Shape module bonding, Glass die bonding, Tape&Reel feeder bonding, Heatsink bonding, Jet dispense under fill, Sintering
Die Bonding
Esec 2100 Series
High performance and intelligent die bonder
Model :
Esec 2100hs, hsi
Esec 2100 sDplus, sD advancedi
Esec 2100 sDPPPplus
The Esec2100 series is a high-speed and high-precision die bonder based on the epoxy die bonding 2100hs series and the stack die bonding 2100sD series. It has continued to evolve as a more intelligent device, such as an auto-adjust function to minimize the influence of quality on operators.
Applications:
Ag paste leadframe base die bonding
Soft Solder Die Bonding
Esec 2100DS
Esec 2009 Series
Designed to meet all future challenges for Power Semiconductor
Model :
Esec 2100DS
Esec 2009SSIE
Esec 2009fSE
Esec2100DS is highly regarded as a flexible and high-speed solder die bonding platform for high-end production sites.
The Esec 2009 series is the only soft solder bonder on the market that can process 12 inch wafers, and also it can secure a market advantage with patented soft solder process technology and .
Applications:
Soft solder leadframe base die bonding (SOP / QFP / QFN etc…)
Flip Chip
Datacon 8800 Series
Esec 2100FC hs
A platform that can offer optimal proposals for requirements such as TC bonding, WL-FOP face-down, face-up, and so on.
Model :
Datacon 8800TC advanced
Datacon 8800FC Quantam advanced
Datacon 8800FC Quantam sigma
Datacon 8800 CHAMEO advanced
Esec 2100FC hs
Datacon 8800TC advanced is a TC bonder that enables high-precision bonding with a unique 7-axis bond head and can meet the advanced requirements of high-end products.
The Datacon 8800FC Quantam series achieves even higher speeds, and the Datacon 8800FC Chameo series is constantly pursuing diversified applications such as WL-FOP processes and large panels.
Applications:
Flip chip bonding, Wafer to Wafer (WtoW) bonding, Chip to Chip (CtoC) bonding, Large panel die bonding, VCSEL die bonding, TC Bonding