As Packaging process system, Besi offers 3 categories,
Besi has the world’s top share of molds for packaging processes. By applying module base system and common software platform, we can also design production lines that go beyond the three categories. Besi propose optimal solution for your packaging process design based on requirements from the customer.
Fico Molding Line (FML) is a transfer molding machine for wafers and large panels. We offer a fully automatic type according to customer specifications and a manual type suitable for R & D. Up to 12 inches of wafers and panels up to 300x340mm.
Wafer molding, Exposed die wafer molding
Mold under fill, Exposed die molding, Multi layer substrate molding, Selective, molding, Dual side molding, SOP / QFN / QFP leadframe molding, Power semiconductor molding
SOP / QFP / QFN leadframe trim and form, Power semiconductor trim and form
BGA substrate sawing, Wafer base module sawing, QFP / QFN leadframe sawing, Wettable Flank (step cut), EMI shielded substrate sawing
Toshin Bldg 2nd Floor, 4-17 Kaigan-dori, Naka-ku, Yokohama-shi, Kanagawa 231-0002 Japan
+8145 222 6420 : Phone / +8145 222 6407 : Fax